STAY-CLEAN® Paste Soldering Flux POP

Category Solder

Description

STAY-CLEAN® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

STAY-CLEAN® Paste Soldering Flux POP

Category Solder

Description

STAY-CLEAN® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

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STAY-CLEAN® Paste Soldering Flux POP

STAY-CLEAN® Paste Soldering Flux POP

Description

Specifications

STAY-CLEAN® Paste Soldering Flux POP

STAY-CLEAN® Paste Soldering Flux POP

Description

Specifications

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